VNCHIP delivered complete turnkey physical implementation from RTL synthesis to tape-out GDSII for a massive 150M-instance AI inference SoC on TSMC N16 FinFET (16nm) technology.
Key Technical Metrics:
- Die Size: ~15 x 18 mm
- Partitions: 26 hierarchical partitions with 8 hardened IP macros
- Clock Domains: 596 asynchronous and synchronous clock domains
- Frequencies: 1.0 GHz core / 1.2 GHz DDR interface
- Signoff Checks: MCMM / POCV STA timing closure, Full EM/IR sign-off, DRC/LVS clean verification
Our engineering team addressed severe cross-talk noise and electromigration constraints through customized clock tree synthesis (CTS) topologies and automated power mesh optimization.
