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Largest-die RTL-to-GDSII — 17.5 x 28 mm

February 10, 2026 Physical Design Team 0 views
Largest-die RTL-to-GDSII — 17.5 x 28 mm
Turnkey full-chip PnR for an Automotive ADAS vision SoC. 13 partitions, 396 clock domains, 10LM5X2Y2ZUTRDL stack. AOCV MCMM STA...

VNCHIP completed the largest die area physical design in its portfolio: a massive 17.5 x 28 mm Automotive ADAS vision processor on TSMC N28 HPC+ (28nm) process.

Key Technical Specs:

  • Die Area: 17.5 x 28 mm reticle-limit challenge
  • Partitions: 13 major subsystem partitions
  • Metal Stack: 10LM 5X 2Y 2Z UTRDL high-density stack
  • Frequencies: 500 MHz core / 800 MHz DDR interfaces
  • Complexity: ~100 Million instances with stringent automotive reliability and thermal grading

The tape-out demonstrated zero DRC violations, complete antenna rule compliance, and verified ESD protection network robustness.

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